Panasonic Global
Search Panasonic Global Site

Automotive & Industrial Systems Company -Industrial Devices-

Global Home Automotive & Industrial Systems Company > Automotive & Industrial Systems Company - Industrial Devices > News Releases > Announcing the release of halogen-free, high thermal conductive glass epoxy multi-layer circuit board materials, “ECOOL® -M”

News Releases

January 9, 2013

High thermal conductive (thermal conductivity of 1.5 W/m・K) on top level in the industry(※1) Announcing the release of halogen-free, high thermal conductive glass epoxy multi-layer circuit board materials, “ECOOL® -M” Suitable for measures for dissipating the heat radiated from devices, such as automotive applications, power devices, and LED lighting.

  • (※1) Our investigation of multi-layer circuit board materials based on organic resin, as of January 9, 2013

January 9, 2013, Osaka, Japan-Industrial Devices Company, Panasonic Corporation has succeeded in commercializing the high thermal conductive (thermal conductivity of 1.5 W/m・K ) materials for multi-layer circuit board materials on top level in the industry (※1), “ECOOL-M”, and will start sample production from Spring in 2013. Newly developed materials are suitable for measures for dissipating the heat radiated from devices, such as automotive applications, power devices and LED lighting.

Product name Halogen-free, high thermal conductive glass epoxy multi-layer circuit board materials, “ECOOL-M”
Product number R-15T1( core materials ), R-14T1 ( prepreg )
Sample production Spring in 2013
Production start Summer in 2013

As semiconductors and electronic components have been improving in performance, and information-communication has been larger in capacity as well as faster in transmission rate, heat-dissipation measures of devices have been significantly requested. Besides, since a variety of devices have been smaller, thinner, and lighter, specific room needed for heat-dissipation design has been seriously lacking. In these circumstances, circuit board materials used in electronic circuits, which are featuring excellent heat-dissipation properties as well as easy to process, have been strongly required in the market. We have been producing “ECOOL®(product number: R-1787) ”, featuring high heat-dissipation properties in spite of organic-resin circuit board materials, and have been rated highly in both markets of single side and double side. On the other hand, the needs for heat-dissipating in the multi‐layer circuit board will be estimated to spread more and more. To meet the market demand, we have succeeded in developing the high thermal conductive (thermal conductivity of 1.5 W/m・K ) materials for multi layer circuit board materials on top level in the industry (※1), “ECOOL-M (product number: R-15T1(core materials), R-14T1( prepreg ) ”, developing the resin design technology used in “ECOOL (product number: R-1787 )”.

Features

1. High thermal conductive (thermal conductivity of 1.5 W/m・K) on top level in the industry(※1)
Our conventional product (※2) : 0.4W/m・K
2. Tracking- resistance properties (CTI 600) on top level in the industry(※1)
Our conventional product (※2) : CTI 200
3. Halogen-free, equivalent to UL Flame-retardant 94V-0
  • (※1) Our conventional product: General organic circuit board materials FR-4(product number: R-1766/R-1661)

Applications

Automotive applications (ECU, head lamp etc.), Power devices (power conditioners, invertors etc.) LED lighting, etc.

The content in the following news releases is accurate at the time of publication but may be subject to change without notice.
Please note therefore that these documents may not always contain the most up-to-date information.

Return to Top

Global Home Automotive & Industrial Systems Company > Automotive & Industrial Systems Company - Industrial Devices > News Releases > Announcing the release of halogen-free, high thermal conductive glass epoxy multi-layer circuit board materials, “ECOOL® -M”