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PCB and Packaging Technology for Creating a New Future for People and the Earth

Packaging technology

  • Development of a short lead-time through the integrated/coordinated design of chips and boards.
  • Optimum package design through thermal, electrical, structural analyses performed upstream of the development work.
  • Distinctive performance packages for individual uses
product/application example : Package

“Integrated/coordinated designing” realizes a first-response operation. for Chips / package / PCB / electricity / heat / structural design.

Industrial applications and development

  • A motherboard for high density mounting that is achieved by Panasonic original material, interconnection, fine patterning and PCB manufacturing technologies.
  • Multi-layer film substrate and organic cavity substrate with any layer IVH, that support to next generation mounting such as thin or 3-D packaging.
  • Integrated/coordinated design constructs the integrity (structural, thermal and electrical) and the hierarchy (chip design, package design and PCB design). This can achieve high-performance packaging in a short lead-time.

PCB and Packaging technology contributes to product sets with higher functionality and to rapid design, leading to the creation of a smart community.

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