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PCB and Packaging Technology for Creating a New Future for People and the Earth

PCB and Packaging technology, one of the Company's core technology, has two features.ALIVH * substrate forming technology

  • High-speed micro via-holes forming by laser drilling
  • Completely filled-via structure guaranteed by printing conductive paste
  • High-layer count structure and short lead-time achieved by precise alignment and lamination technology

product/application example : ALIVH substrate

ALIVH motherboard with any layer IVH structure contribute to the high performance smart phones.

Microfabrication, thinner multi-layer structure, and short lead time help the evolution of the future mobile devices.

Packaging technology

  • Development of a short lead-time through the integrated/coordinated design of chips and boards.
  • Optimum package design through thermal, electrical, structural analyses performed upstream of the development work.
  • Distinctive performance packages for individual uses
product/application example : Package

“Integrated/coordinated designing” realizes a first-response operation. for Chips / package / PCB / electricity / heat / structural design.

Industrial applications and development

  • A motherboard for high density mounting that is achieved by Panasonic original material, interconnection, fine patterning and PCB manufacturing technologies.
  • Multi-layer film substrate and organic cavity substrate with any layer IVH, that support to next generation mounting such as thin or 3-D packaging.
  • Integrated/coordinated design constructs the integrity (structural, thermal and electrical) and the hierarchy (chip design, package design and PCB design). This can achieve high-performance packaging in a short lead-time.

PCB and Packaging technology contributes to product sets with higher functionality and to rapid design, leading to the creation of a smart community.

  • * ALIVH (Any Layer Interstitial Via Hole)
    ALIVH is a multi-layer resin board developed and commercialized by Panasonic as the world's first full-layer Interstitial Via Hole (IVH). In October 1996, using ALIVH boards, Panasonic (then known as Matsushita Electric Industrial Co., Ltd.) developed a mobile phone that was the lightest and smallest in the industry at that time with less than 100 g in weight and less than 100 cc in volume. Since then, ALIVH boards have been widely used in Japan and overseas. As of December 2011, global shipments of ALIVH boards exceeded 450 million units in terms of mobile phones.

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