Panasonic Global
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Product Lineup
| Non-Shrinkage high density package substrate |
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| Enabled Ultra small & thin package form factor The best suit for high frequency components & module circuit |
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Terms and Conditions |
| Non-Shrinkage high density package substrate - Features |
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High precision non-shrinkage ceramic substrate with the shrinkage tolerance of +/-0.05%
The best suit for high frequency circuit board with outstanding high frequency performance and its engineering simulation technique
Enabled ultra small thin form factor with bear chip mounting and components embedded technology
Correspond to the other service requirements as well, such as SMD, flip chip mounting and so on.
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